PRODUCT FEATURES:
1. Vector analysis algorithm,integrated variety of software algorithms to achieve the best inspection capability
2.Offline programming and debugging.
3.The equipment can communicate directly with the NG BUFFER device and other equipment through the communication protocol.
FUNCTION MODULE:
1.Al Intelligent Recognition and various vector image algorithms to get the best inspection capability
By using Al to automatically build a database,automatically configure detection thresholds,and integrate traditional vector analysis algorithms,It can achieve efficient programming and optimal configuration of detection algorithms,thereby improving programming efficiency while ensuring detection capabilities.
| CATEGORY | ITEM | S810/S820/S830 S810L/S820L/S830L |
| RecognitionSystem
| Inspection | AIIntellgent detectlon algorthmnt,he vectorimage algorthmsindudeloglc operaton,dstance of luminance bounday,chptrachg.OCR/OCV,uminancelclor emplate matc colordstance,color extractlon(RGB &HSV,value-range of luminance,offsat of luminance,the minimum variation span of luminance ate More than 30 kinds of the most advanced algorithms |
| Camera | 5MP7High performanoe 5MP712MP (20 and 25MP optional) |
| Lens | High-resolution telecentric Lens,20μm,15μm,12um,10μm,8μm for option |
| Lamp-house | Ring tower structure,high intensityRGBW flash lighting |
| FOV | 48.96×40.96 mm(5MP &20μm)/36.72×30.72 mm(5MP &15μm) 50×45mm(12MP&15μm)/40×30mm(12MP&10μm) |
| 0201 Chip | <7.6ms |
| Per-image Time | 220～450ms |
| Paste Printing Defects | Missing.overflow,insufficlent,pasting open,stain |
| Component Defects | Mssing.shift,skewed,tombstone,bllboard,overtumed,reversed polarity,wrong.damaged |
| Solder Defects | Overflow,insufficient,short solder,stain |
| WaveSokdering Inspect | Overflow,insufficient,short,excess solder,solder void |
| Inspection tems | 0201&0.4mmpitch(20μm) 01005&0.3mm pitch(15μm) |
| Mechanism System
| PCB Conweyor | Bottom to updlamping.Automatic PCB loading and unbading.automatic adjust the conveyor width,5MEMA standard communicationprotocol. Theconveyor height 900±20mm |
| PCB Size | 50×50mm~400×330mm 50×50mm~510×460mm |
| PCB Thickness | 0.5-5.0mm |
| PCB Warp Tolerance | ±2mm |
| Component Clearance | TOP≤30mm,BOT≤30mm |
| Drver | AC servo system,camera moves inthe directions of XY |
| Orlentation | <10μm |
| Mowing Speed | Standard:500mm/s,Max800mm/s |
