YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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PRODUCT FEATURES:
1. Vector analysis algorithm,integrated variety of software algorithms to achieve the best inspection capability
2.Industrial camera,multiplespecifications for selecton
3.The new light source design,effectively eliminate the NG parts.
FUNCTION MODULE:
1.Al Intelligent Recognition and various vector image algorithms to get the best inspection capability
By using Al to automatically build a database,automatically configure detection thresholds,and integrate traditional vector analysis algorithms,It can achieve efficient programming and optimal configuration of detection algorithms,thereby improving programming efficiency while ensuring detection capabilities.
2.High definition high-performance industry camera
With a high color reproduction,collocate a high-resolution telecentric Lens,high NG identification,provide high- definition imageoutput for the AOI.
| CATEGORY | ITEM | S810/S820/S830 S810L/S820L/S830L |
|
RecognitionSystem
| Inspection | AIIntellgent detectlon algorthmnt,he vectorimage algorthmsindudeloglc operaton,dstance of luminance bounday,chptrachg.OCR/OCV,uminancelclor emplate matc colordstance,color extractlon(RGB &HSV,value-range of luminance,offsat of luminance,the minimum variation span of luminance ate More than 30 kinds of the most advanced algorithms |
| Camera | 5MP7High performanoe 5MP712MP (20 and 25MP optional) | |
| Lens | High-resolution telecentric Lens,20μm,15μm,12um,10μm,8μm for option | |
| Lamp-house | Ring tower structure,high intensityRGBW flash lighting | |
| FOV | 48.96×40.96 mm(5MP &20μm)/36.72×30.72 mm(5MP &15μm) 50×45mm(12MP&15μm)/40×30mm(12MP&10μm) | |
| 0201 Chip | <7.6ms | |
| Per-image Time | 220～450ms | |
| Paste Printing Defects | Missing.overflow,insufficlent,pasting open,stain | |
| Component Defects | Mssing.shift,skewed,tombstone,bllboard,overtumed,reversed polarity,wrong.damaged | |
| Solder Defects | Overflow,insufficient,short solder,stain | |
| WaveSokdering Inspect | Overflow,insufficient,short,excess solder,solder void | |
| Inspection tems | 0201&0.4mmpitch(20μm) 01005&0.3mm pitch(15μm) | |
| Mechanism System | PCB Conweyor | Bottom to updlamping.Automatic PCB loading and unbading.automatic adjust the conveyor width,5MEMA standard communicationprotocol. Theconveyor height 900±20mm |
| PCB Size | 50×50mm~400×330mm 50×50mm~510×460mm | |
| PCB Thickness | 0.5-5.0mm | |
| PCB Warp Tolerance | ±2mm | |
| Component Clearance | TOP≤30mm,BOT≤30mm | |
| Drver | AC servo system,camera moves inthe directions of XY | |
| Orlentation | <10μm | |
| Mowing Speed | Standard:500mm/s,Max800mm/s |