YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine
Product Description
| Equipment parameters | Dimension (LxWxH) | 1900 x 1740 x 1665 (mm) | ||
| Transport Parameters | Transport width adjustment | 50 - 460 (mm) | ||
| PCB size | L340 * W460 (mm) | |||
| Conveyor height | 900±20(mm) | |||
| Thesolderingsystem | Solder pot | Electromagnetic pump tin solde「 pot | ||
| solder pot numbers | single pot | Dual pots | St ove 2 | |
| solder pot numbers | 0.5KG/ pot/ week x1 | 0.5KG/ pot / week x2 | ||
| Nit rogenconsumption | 1.5- 2m³/h/pot x 1 | 1.5 - 2m³/h/pot x2 | ||
FLUX SPRAY MODULE
Introduction:
The spray head which is imported from Germany offers an absolutely precise and
well defined flux deposition on even the smallest areas. The flux is targeted to be
applied only to the solder joint,whereby the wettable area can be as small as 3
mm.with the effect that ionic contamination is minimized and flux consumption is
duced.
Features:
Saving 90%flux compared to traditional mode.
The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free.
Two axis servo motor control, high positioning accuracy.
Minimum ionic contamination.
| Specifications: | |
| Flux module x axis distance (max.) | 510mm |
| Flux module y axis distance (max.) | 450mm |
| Max. nozzle speed | 7m/min |
| Flux content | 2 L |
| Flux type | RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1 |
| Flux effective level | L0, L1, M0 |
| Nozzle | 130 μm, alternative diameter |
| Spray pressure | 0.5~1.0 bar |
| Spray width | 2~8 mm (with spray nozzle 130 μm) |
| Spray speed | 20 mm/s |
| Positioning speed | 400 mm/s |
| Positioning accuracy | ±0.2 mm |
| Flux system | 2-axis With Servo Drive |
PREHEATING MODULE
Introduction:
The current selective soldering processes, in particular those for lead-free soldering,
multi-layer boards or high mass components, call for increased preheat capacities.
Short wave IR heater on the bottom and hot air convective preheating on the top, to
ensure preheating evenly.
Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).
| Specifications: | |
| Top heater power | 4KW |
| Top heater voltage | 220V |
| Bottom heater powerr | 4.8KW |
| Bottom heater voltage | 220V |
| CDA pressure | 0.5-0.7MPa |
Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.
| Specifications: | |
| Solder nozzle position | Middle |
| Solder content | 13 Kg |
| Max. soldering temperature | 350 °C |
| Min. internal diameter of solder nozzle | 3 mm, External Diameter 4.5 mm |
| Max. Solder wave height | 5 mm |
| Soldering speed X,Y-axis | 10 mm/s |
| Positioning speed X,Y-axis | 200 mm/s |
| Positioning speed Z-axis | 100 mm/s |
| Positioning accuracy | ±0.15 mm |
| Max.solder distance(x axis) | 510mm |
| Max.solder distance(y axis) | 460mm |
| Max.distance of z-axis | 58mm |
| Max.pot moving speed | 5.8m/min |
| Control system | 3-axis With Servo Drive |
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