YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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SMT C Selective Wave Soldering Machine Provided 220V Automatic PCB Ultrasonic Soldering Machine Trade
Product Description
| Equipmentparameters | Dimension (LxWxH) | 3000 x 1845 x 1565(mm) |
| Tran sport Parameters | PCBsize | L400* W460 (mm) |
| Conveyor height | 900 ±20 (mm ) | |
| The solderingsystem | Solder pot | Elec tro magnet ic pump tin solder pot |
| the number of tin stove | sing le pot | |
| Theamountof tindross | 0.5KG/ pot／week x 2 | |
| Nitrogen consumption | 1.5 - 2m³/h/ pot x 2 |
| Specifications: | |
| Flux module x axis distance (max.) | 510mm |
| Flux module y axis distance (max.) | 450mm |
| Max. nozzle speed | 7m/min |
| Flux content | 2 L |
| Flux type | RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1 |
| Flux effective level | L0, L1, M0 |
| Nozzle | 130 μm, alternative diameter |
| Spray pressure | 0.5~1.0 bar |
| Spray width | 2~8 mm (with spray nozzle 130 μm) |
| Spray speed | 20 mm/s |
| Positioning speed | 400 mm/s |
| Positioning accuracy | ±0.2 mm |
| Flux system | 2-axis With Servo Drive |
Introduction:
The current selective soldering processes, in particular those for lead-free soldering,
multi-layer boards or high mass components, call for increased preheat capacities.
Short wave IR heater on the bottom and hot air convective preheating on the top, to
ensure preheating evenly.
Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).
| Specifications: | |
| Top heater power | 4KW |
| Top heater voltage | 220V |
| Bottom heater powerr | 4.8KW |
| Bottom heater voltage | 220V |
| CDA pressure | 0.5-0.7MPa |
Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.
| Specifications: | |
| Solder nozzle position | Middle |
| Solder content | 13 Kg |
| Max. soldering temperature | 350 °C |
| Min. internal diameter of solder nozzle | 3 mm, External Diameter 4.5 mm |
| Max. Solder wave height | 5 mm |
| Soldering speed X,Y-axis | 10 mm/s |
| Positioning speed X,Y-axis | 200 mm/s |
| Positioning speed Z-axis | 100 mm/s |
| Positioning accuracy | ±0.15 mm |
| Max.solder distance(x axis) | 510mm |
| Max.solder distance(y axis) | 460mm |
| Max.distance of z-axis | 58mm |
| Max.pot moving speed | 5.8m/min |
| Control system | 3-axis With Servo Drive |
Packaging & Shipping
