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YUSH Electronic Technology Co.,Ltd

YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.

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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

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YUSH Electronic Technology Co.,Ltd
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City:suzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MsEva liu
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China 8KW CCD Automatic Align Semiconductor Wafer Cutting Machine wholesale
  • China 8KW CCD Automatic Align Semiconductor Wafer Cutting Machine wholesale

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
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Brand Name :YUSHUNLI
Model Number :ADS2000
Certification :CE
Place of Origin :China Dongguan
MOQ :1set
Price :USD1000~10000
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :60Sets/Month
Delivery Time :5-7work days
Packaging Details :plywooden case
Dimensions of processing :Φ300mm
power supply :3P , 220 (50 ~ 60 Hz)V
machine power :8KW
Power air pressure :0.6 ~ 0.68MPa
Air consumption :250L/min
Cutting water consumption :6.5L/min
cooling water consumption :2.5L/min
（W×D×H） physical dimension :1262×1704×2023mm
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View Product Description
Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
• CCD automatic align.
• Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
• Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
• Repeat positioning accuracy : 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Each magazine can be stored 20 ~ 30 layers of frame.
• Standard collocation of using blade size: 2 Inch(Max:3 Inch)
Specs:
x-axis
Working stroke
500mm
cutting speed
0.05 ~ 400mm/sec
resolution
 0.0001mm
y-axis
Working stroke
650mm
resolution
0.0001mm
Repeat positioning accuracy
0.001 / 310mm
z-axis
Working stroke
60 (2 Inch blades)mm
resolution
0.0001m
Θ-axis
Angle of rotation
 360deg

Dimensions of processing
Φ300mm
Dimensions of working platform
Φ350
power
2.4×2 set KW
speed
5,000 ~ 60,000 rpm
power supply
3P , 220 (50 ~ 60 Hz) V
machine power
 8KW
Power air pressure
0.6 ~ 0.68MPa
Air consumption
 250L/min
Cutting water consumption
 6.5L/min
cooling water consumption
 2.5L/min
(W×D×H) physical dimension
1262×1704×2023
machine net weight
 1000KG

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
Process description
1.Mechanism remove it from magazine,and send it to the temporary table.
2.Unloading robot will move the dicing material to chunk. for dicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporary table.
5.Robot send the dicing material to the magazine .
8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
Optional equipment
1,Function of blade damage detection;
2,Automatic setting function;
3,Dicing visual function;
4, Using dicing blade with 3 Inch.
Case Sharing

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

Product Tags:

vmc machining center

bias-cutting machine

precision cnc machining center
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