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YUSH Electronic Technology Co.,Ltd

YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.

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12 Years
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2.4KW 60000rpm Wafer Cutting Machine For PCB

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YUSH Electronic Technology Co.,Ltd
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City:suzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MsEva liu
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China 2.4KW 60000rpm Wafer Cutting Machine For PCB wholesale
  • China 2.4KW 60000rpm Wafer Cutting Machine For PCB wholesale

2.4KW 60000rpm Wafer Cutting Machine For PCB
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Brand Name :YUSHUNLI
Model Number :SDS1000
Certification :CE
Place of Origin :China Dongguan
MOQ :1set
Price :USD1000~40000
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :200Sets/Month
Delivery Time :5-7work days
Packaging Details :plywooden case
cutting speed :0.05 ~ 400mm/sec
resolution :0.0001mm
Repeat positioning accuracy :0.001 / 310mm
Angle of rotation :360 deg
speed :5,000 ~ 60,000rpm
power supply :3P , 220 (50 ~ 60 Hz)V
machine power :4KW
Power air pressure :0.5 ~ 0.6 MPa
Air consumption :200 L/min
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2.4 KW Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
•Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm)
•Repeat positioning accuracy : 0.001mm
•Cutting speed: 0.05 ~ 400 mm/sec
•Standard collocation of using blade size:2 Inch (Max:3 Inch)
• CCD automatic align.
• Real-time monitoring system of air pressure, water pressure,current, etc., to avoid damage to the air spindle.
x-axis
Working stroke
340MM
cutting speed
0.05 ~ 400mm/sec

resolution
0.0001MM

y-axis
Working stroke
 310MM
resolution
0.0001MM
Repeat positioning accuracy
0.001 / 310MM

z-axis
Working stroke
60 (2 InchBlade)mm
resolution
0.0001mm

Θ-axis
Angle of rotation
 360deg
Specifications:
Dimensions of processing
Φ300mm
Dimensions of working platform
Φ350mm
power
 2.4KW
speed
5,000 ~ 60,000 rpm
power supply
3P , 220 (50 ~ 60 Hz)v
Power air pressure
0.5 ~ 0.6 MPa
Air consumption
 200L/min
Cutting water consumption
 4.0L/min
cooling water consumption
 1.5L/min
(W×D×H) physical dimension
1040×1080×1750mm
machine net weight
 850KG

Features of products

• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
2.4KW 60000rpm Wafer Cutting Machine For PCB
2.4KW 60000rpm Wafer Cutting Machine For PCB
Product Tags:

wafer cutting machine

pcb v cut machine

pcb board cutting machine
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