YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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2L 1.5-2m³/h/potx1 Selective Soldering Machine FLUX SPRAY MODULE lead free reflow oven
Technical Parameters:
| Machine Size | 1900x1735x1665 (mm) | |
| Transport width adjustment | 50-460 (mm) | |
| PCB size | L340*W460 (mm) | |
| Conveyor height | 900±20(mm) | |
| Solder pot | electromagnetic pump tin solder pot | |
| The amount of tin dross | single pot/dual pots | Stove 2 |
| Nitrogen consumption | 0.5KG/pot/week x1 | 0.5KG/pot/week x2 |
| solder pot numbers | 1.5-2m³/h/potx1 | 1.5-2m³/h/potx2 |
FLUX SPRAY MODULE
Introduction:
The spray head which is imported from Germany offers an absolutely precise andwell defined flux deposition on even the smallest areas. The flux is targeted to beapplied only to the solder joint,whereby the wettable area can be as small as 3mm.with the effect that ionic contamination is minimized and flux consumption is duced.
Features:
Saving 90%flux compared to traditional mode.The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free.Two axis servo motor control, high positioning accuracy.
Minimum ionic contamination.
| Specifications: | |
| Flux module x axis distance (max.) | 510mm |
| Flux module y axis distance (max.) | 450mm |
| Max. nozzle speed | 7m/min |
| Flux content | 2 L |
| Flux type | RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1 |
| Flux effective level | L0, L1, M0 |
| Nozzle | 130 μm, alternative diameter |
| Spray pressure | 0.5~1.0 bar |
| Spray width | 2~8 mm (with spray nozzle 130 μm) |
| Spray speed | 20 mm/s |
| Positioning speed | 400 mm/s |
| Positioning accuracy | ±0.2 mm |
| Flux system | 2-axis With Servo Drive |